Advanced Packaging and Heterogeneous Integration Engineer
HRLLocation not specified
Full Time
Posted October 23, 2025
$133k - $166k
Not Specified
Visa Sponsored
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Job Description
This role involves leading research and development of advanced 2.5D and 3D heterogeneous integration technologies for RF and Millimeter-Wave systems, focusing on design, analysis, and manufacturing of microelectronic packaging solutions, while providing technical mentorship and collaborating with cross-functional teams.
Key Responsibilities
- Research and develop novel 2.5D and 3D heterogeneous integration technologies for RF and millimeter-wave applications.
- Design and analyze integration approaches considering electrical, thermal, and mechanical constraints from conceptual to manufacturing stages.
- Participate in cross-functional R&D projects, providing technical guidance and mentorship.
- Develop and maintain relationships with vendors and partner organizations.
- Organize, present, and publish research findings through reports, papers, and presentations.
- Lead and contribute to proposal development and marketing efforts to secure research funding.
Requirements
- More than 5 years of hands-on experience developing novel 2.5D and 3D microelectronic packaging and heterogeneous integration for RF mm-W microsystems.
- Experience with design of experiments and analysis techniques electrical, mechanical, thermal, chemical, etc. needed to develop and assess new process integration modules and techniques.
- More than 5 years of experience in organizing and or leading technical research and development efforts, including US government proposal and marketing activities, and in preparing presentations and proposals needed to attract research funding.
- Experience developing external partnerships and vendor relationships.
- Experience with traditional as well as advanced packaging techniques e.g. ceramic and laminate chip-level packages, printed circuit boards, SoC, SiP, MCM, HD interposers, etc.
- Candidates should possess a proven track record of developing novel and successful solutions to complex technical issues.
- Extensive knowledge of RF mm-W 0.1-200 GHz with strong electromagnetic (EM) background.
- Knowledge of multi-physics simulation tools e.g. ANSYS, COMSOL, high frequency and RF simulation tools e.g. ADS, MWO, Cadence, electromagnetic simulation tools e.g. HFSS or CST.
- Deep understanding of electro-thermal-mechanical design trade-offs and design for manufacturing reliability.
- Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors and colleagues, and willingness to work in a fast-paced, deadline-driven environment.
- Ability to work well in a team and independently.
- Ph.D. or M.S. degree in Electrical Engineering, Mechanical Engineering, Physics, or related scientific discipline.
- Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
- Current U.S. person or U.S. citizen with the ability to obtain and maintain a U.S. government security clearance is a plus.
Benefits & Perks
Base salary range of $132,765 - $165,983
Bonus benefits
Work environment with a fast-paced, deadline-driven setting
Opportunities for research funding through proposals and marketing efforts
Potential for career development through mentorship and leadership roles
Possibility to work in a collaborative team environment
Ready to Apply?
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