Sr. Principal Metrology Engineer

• Develop, validate, and optimize metrology techniques for single-crystal diamond materials and devices, with emphasis on surface, structural, and wafer-level characterization, including recipe development and optimization for precision wafer measurements across process flows, and support thermal characterization activities. • Establish metrology protocols for critical backend processes (e.g., singulation, polishing, thinning, cleaning, and bonding), implement statistical process control (SPC), and ensure compliance with industry standards. • Collaborate with R&D and process engineering to correlate metrology data with process variations, conduct failure analysis, and optimize process flows. • Partner with manufacturing teams to ensure seamless integration of metrology solutions into production workflows, troubleshoot measurement-related challenges, and interface with equipment vendors. • Develop automated data analysis pipelines to enhance efficiency and accuracy in measurement reporting.

• PhD or MS in Physics, Materials Science, Electrical Engineering, or a related field with 5+ years (PhD) / 8+ years (MS) of experience in semiconductor, advanced materials, metrology, or failure analysis. • Experience in advanced characterization techniques such as AFM, WLI, AOI, SEM, and wafer characterization, including tool qualification, calibration, and maintenance. Experience in thermal and electrical characterization (TDTR, FDTR, LFA, EBD, etc.) is a plus. • Proficient in statistical data analysis, SPC, and software tools such as JMP, Python, or MATLAB. • Familiarity with semiconductor backend processes (e.g., CMP, dicing, bonding) is highly desirable. • Excellent communication and strong problem-solving skills, as well as the ability to work in a fast-paced, cross-functional environment.