Senior NPI Engineer

• Support transition of critical automated mirco-optical alignment from engineering to high volume manufacturing at CM. • Ensure end-to-end assembly process readiness for complex lidar systems at manufacturing partners. • Yield analysis monitoring and drive continuous improvement initiatives for NPI production lines, ensure optimal yield and efficiency to achieve capacity and cost target. • Maintain products’ quality by improving design and manufacturing process as well as equipment stability. • Provide onsite engineering support: technical ownership and support for process or equipment issues. • Provide feedback on manufacturing and service requirements, process control plans, and quality assurance. Develop hardware standards and design guidelines. • Own control plans, manufacturing BOM, and necessary documentation to transfer HW from design to the production floor, whether internal or external. • Review data packages before they are released for manufacturing. • Create and maintain work instructions, standard operating procedures, forms, records, checklists, process sequence/routing, Process Flow Diagrams (PFD), PFMEAs, and other required manufacturing documentation • Support and guide the manufacturing team through all phases of Advanced Product Quality Planning (APQP); particularly the later phases associated with designing and developing the manufacturing process and validating the Process / Product (i.e., MSAs, production trial runs, Run @ Rate, PPAPs, control plans) • Research manufacturing fabrication and processes new to the company and guide design engineers on their use. Create Requests for Quotation/Proposal when necessary. • Act as a liaison between the module, integration and electrical teams and cross-functional teams for planning, logistics, and ad hoc requests. Organize cross-functional design reviews. • Lead or participate in Kaizen activities to ensure continuous improvement in processes, products, components, raw materials, and equipment • Quickly come-up-to speed on new technologies and engineering challenges • Conduct multidisciplinary rapid problem-solving activities and propose solutions to both prototype and production manufacturing challenges, such as Design for Excellence (DfX) input, e.g., Design for Manufacturing (DfM), Design for Assembly (DfA), Design for Cost/Procurement (DfC/DfP), Design for Inspection/Test (DfI/T), Design for Service/Repair/Maintenance (DfS/R/M) • Work with internal production and external CMs. • Communicate clearly both verbally and in writing. • International Travel 20-35%. Concentrated around line bringup. • Evening Conference calls with CM in Asia 2-3 times a week.

• Minimum of 8 years experience in engineering role with experience working in low to high volume production environments. • Bonus points for experience in AV, robotics, or the automotive industry. • Experience with launching hardware products and the product life cycle, and selecting the right-sized process based on the needs of the program. • Experience in relevant fields – optical alignment process development, optical interconnect, chip-to-chip coupling, and FAU alignment • Participate in the process of bringing up a new technology from the R&D stage to high volume manufacturing. • Proficient in SPC, 6 sigma, quality control process; good understanding of machine and process interactions. • We are seeking applicants who demonstrate the ability to work independently, deliver results promptly, communicate effectively, operate with a sense of urgency, and thrive in a fast-paced development and production environment. • Experience with working with supply chain and vendors, bonus points for experience in design engineering and new product introduction. • Working knowledge of GD&T. • Experience with 3D CAD and PDM/PLM, preferably Catia/Solidworks and Enovia/EPDM. • Need to live in a high output constantly evolving environment wearing many hats that include everything from concepts to sustaining engineering. • Extensive design experience that can be leveraged to successfully work with cross-functional partners like the internal design team and external CM’s. • Experience in the automotive industry • Experience with optical, electro-optical, and opto-mechanical assembly and manufacture. • Knowledge in Flip Chip Packaging / multi-chip module/ hybrid bonding / Optical Connector Assembly/ Optical Connector to chip attach. • Hands-on experience working with packaging / bonding machines and optimize process recipes. • Knowledgeable in DFx, FMEA process, and failure analysis methodologies. • Experience with materials, adhesives, thermal/mechanical interactions, and reliability considerations in optical hardware • Know-how of yield analysis and process cycle time reduction methodology. • Experience working with OSAT in volume manufacturing environment as well as a background with the semiconductor or optical communication industry. The base salary range for this position is $115,000 - $184,000 per year. Aurora’s pay ranges are determined by role, level, and location. Within the range, the successful candidate’s starting base pay will be determined based on factors including job-related skills, experience, qualifications, relevant education or training, and market conditions. These ranges may be modified in the future. The successful candidate will also be eligible for an annual bonus, equity compensation, and benefits. #LI-JH1 #Mid-Senior Working at Aurora At Aurora, we bring together extraordinarily talented and experienced people united by the strength of our values. We operate with integrity, set outrageous goals, and build a culture where we win together — all without any jerks. We believe in-person work increases collaboration, empathy and our ability to lead effectively. As a result, we operate in a hybrid work environment where Aurorans are in office at least 3 days per week. Our Careers page provides insight into what it is like to work at Aurora, and you can find all the latest updates in our Newsroom .