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  3. Director, Infrared Sensor Fabrication/ Manufacturing
HRL logo

Director, Infrared Sensor Fabrication/ Manufacturing

HRL
Camarillo, California
Full Time
Posted September 26, 2025
$217k - $278k
Not Specified
Apply Now

Application opens on company website

Job Description

The Director of Manufacturing Operations will lead the setup and scaling of semiconductor sensor fabrication, overseeing the transfer of laboratory processes to a new manufacturing facility, managing operational performance, and driving continuous improvement in a high-growth environment for aerospace and defense products.

Key Responsibilities

  • Lead and manage the transfer of manufacturing capacity from laboratory to new facility, including stand-up and qualification.
  • Oversee core operational processes for high-growth semiconductor business to enable scalable growth and execution.
  • Create, monitor, and analyze KPIs to assess operational performance and inform decision-making.
  • Identify operational process improvements to increase efficiency and productivity.
  • Manage budgets, control costs, and ensure financial efficiency within operations.
  • Oversee supplier and vendor relationships to ensure quality and cost-effectiveness.
  • Ensure compliance with laws, regulations, and company policies across operations.
  • Align operational activities with customer satisfaction goals and resolve related issues.
  • Oversee materials planning, forecasting, and product mix management for pre-production and production.
  • Implement best practices for customer configuration management of high-complexity products.
  • Collaborate with supply chain, engineering, and manufacturing teams to optimize production flow and reduce cycle times.
  • Represent operations in new product development, strategic planning, and product portfolio decisions.
  • Organize and facilitate operational reviews and strategic planning activities.

Requirements

  • Bachelor's degree in engineering or related fields and 15 years of relevant semiconductor experience.
  • Proficiency in using operational management software and tools.
  • A background in semiconductor product engineering with an emphasis on packaging camera sensors image sensors with full lifecycle responsibility from NPI launch to EOL.
  • Strong understanding of operational processes and best practices.
  • The ability to collaborate with peers and independently multitask, prioritize, make high-level decisions, meet aggressive deadlines, and communicate results, trade-offs, and decisions to all stakeholders.
  • U.S. citizenship with the ability to obtain and maintain a US Government Security Clearance.
  • Active security clearance is a plus.

Benefits & Perks

Compensation/salary range: 216,900 - 278,000 USD plus bonus benefits
Work schedule: Not specified
Work environment perks: Not specified
Additional benefits: Bonus benefits, potential for career growth, opportunities for strategic leadership, and working in a high-velocity business environment

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