Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every c
Key Responsibilities
Support customer prototyping projects to integrate single-crystal diamond with customer devices and demonstrate thermal and performance benefits.
Develop advanced packaging and bonding processes adaptable to diverse customer device designs, material stacks, package configurations, and integration requirements.
Evaluate, select, and optimize bonding technologies, including pressure/pressureless sintering, thermocompression, surface/plasma-activated bonding, and emerging methods.
Drive internal process development and validation, including cleaning, metallization, DOE-based bonding optimizations, process characterization, failure analysis, and reliability testing.
Bachelor’s or advanced degree in materials science, electrical engineering, chemical engineering, or a related field.
Experience in semiconductor packaging, advanced materials, process engineering, device integration, or related technical development is preferred.
Familiarity with bonding, thin-film deposition, surface preparation, metrology, failure analysis, reliability testing, or similar process technologies is desirable.
Strong problem-solving skills and willingness to learn new materials, tools, and processes.
Good communication skills and ability to work effectively with cross-functional teams, hands-on, detail-oriented, motivated, and comfortable working in a fast-paced development environment.
Ready to Apply?
Join Diamond Foundry and make an impact in renewable energy