Open in the current public read path; this is not an employer guarantee.Last observed October 8, 2026
Classification
Modern power-system classification not yet published for this listing.Legacy source industry field: Not Specified
Pay provenance
Pay not available
Job Description
Job Responsibilities
Key Responsibilities
Job Responsibilities
Mechanical Structure Design: Lead the structural development of power products for telecom and data center servers, covering conceptual design, detailed design, thermal design collaboration, prototype assembly, packaging & protection design, and NPI (New Product Introduction); independently deliver full-set technical documentation.
Customer & Project Alignment: Deeply engage in technical responses and solution evaluations during RFI/RFP/RFQ stages for overseas clients; drive efficient technical alignment with the Global Team, and lead the resolution of critical technical challenges during product development and test verification.
Technical Planning & Problem Solving: Participate in formulating the technology roadmap for High-Voltage Direct Current (HVDC) and data center power products; lead advanced research and implementation of innovative solutions featuring new materials, new processes (e.g., die-casting replacement, 3D Vapor Chamber), lightweighting, and high power density.
Platforming & Standardization: Drive modular design for product structural platforms, summarize design experiences, as well as author and maintain enterprise-grade mechanical design standards, DFMEA, and safety compliance databases.
Industry Insights: Track cutting-edge industry technologies (such as liquid cooling), continuously optimizing product performance, reliability, and Design for Manufacturability (DFM).
Job Requirements
Educational Background: Bachelor’s degree or above in Mechanical Engineering and Automation, Mechatronics, or related majors; foundational knowledge in power electronics or electrical engineering is preferred.
Experience Requirements: 5+ years of mechanical design experience in the power supply industry, with proven mass-production experience in server power supplies, telecom power supplies, or similar power products (Mandatory). Familiarity with design requirements for OCP, ORV3, and related standards is preferred.
Professional Skills: Proficient in design tools such as Creo 10.0, CAD, and CorelDRAW. Simulation Capabilities: Proficiency in thermal simulation (Flotherm/Icepak) or structural mechanics simulation (ANSYS) is preferred. Proficient in sheet metal, die-casting, injection molding processes, and surface treatment technologies; deep understanding of safety compliance (UL/IEC 62368-1), EMC, and thermal design principles.
Language Proficiency: English as a working language; able to independently read English standards and communicate seamlessly with overseas teams/clients via email and video conferences.
Competencies: Excellent cross-functional communication skills and logical thinking; meticulous work ethic, capable of thriving under fast-paced R&D pressure, with a strong drive for technical problem-solving.