Job Description
The Advanced Packaging Solutions Group Lead will oversee a team focused on developing innovative packaging solutions for RF and millimeter-wave subsystems, while also managing resources and talent acquisition. This role combines leadership responsibilities with hands-on technical contributions in the research and development of advanced microelectronic packaging technologies.
Key Responsibilities
- Manage resources and talent acquisition for the APS Group.
- Lead research and development of 2.5D and 3D heterogeneous integration technologies for RF and mmW applications.
- Provide mentorship and guidance to team members on technical and organizational aspects.
- Organize and present results in written reports, journal papers, and oral presentations.
- Create and manage work plans to meet schedule deadlines and technical expectations.
- Contribute to proposal and marketing efforts to sustain R&D initiatives.
Requirements
- More than 15 years of hands-on experience with developing novel 2.5D and 3D microelectronic packaging and heterogeneous integration for RF mmW microsystems.
- At least 3-5 years of experience in a role involving leadership of highly trained technical staff.
- Extensive experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical) needed to develop and assess new process integration modules and techniques.
- Experience with leading US government proposal and marketing activities.
- Demonstrated experience developing external partnerships and vendor relationships.
- Several years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding.
- Experience with traditional as well as advanced packaging techniques (e.g. ceramic and laminate chip-level packages, printed circuit boards, SoC, SiP, MCM, HD interposers).
- Extensive knowledge of RF mmW (0.1-200 GHz) with strong electromagnetic background.
- Extensive knowledge of semiconductor microfabrication.
- Knowledge of multi-physics simulation tools (e.g. ANSYS, COMSOL), high frequency and RF simulation tools (e.g. ADS, MWO, Cadence), and electromagnetic simulation tools (e.g. HFSS or CST).
- Required Education: MS or Ph.D. degree in Electrical Engineering, Mechanical Engineering, Physics, or related scientific discipline.
- US citizen status is required.
- Ability to obtain and maintain a US Government Security Clearance.
- Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, and interaction with vendors and colleagues.
- Ability to work well in a team and independently.
- Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
Benefits & Perks
Compensation/salary range: 182,720 - 234,168
Bonus benefits
Full-time position
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