R&D Process Engineer, Advanced Bonding Process Development

• Support customer prototyping projects to integrate single-crystal diamond with customer devices and demonstrate thermal and performance benefits. • Develop advanced packaging and bonding processes adaptable to diverse customer device designs, material stacks, package configurations, and integration requirements. • Evaluate, select, and optimize bonding technologies, including pressure/pressureless sintering, thermocompression, surface/plasma-activated bonding, and emerging methods. • Drive internal process development and validation, including cleaning, metallization, DOE-based bonding optimizations, process characterization, failure analysis, and reliability testing. • Manage end-to-end project execution, covering schedules, technical risks, cross-functional communication, customer updates, and technical reports.

• Bachelor’s or advanced degree in materials science, electrical engineering, chemical engineering, or a related field. • Experience in semiconductor packaging, advanced materials, process engineering, device integration, or related technical development is preferred. • Familiarity with bonding, thin-film deposition, surface preparation, metrology, failure analysis, reliability testing, or similar process technologies is desirable. • Strong problem-solving skills and willingness to learn new materials, tools, and processes. • Good communication skills and ability to work effectively with cross-functional teams, hands-on, detail-oriented, motivated, and comfortable working in a fast-paced development environment.